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surface mounting
表面贴装:一种电子元器件安装技术
常用释义
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基本释义
  • 表面贴装:一种电子元器件安装技术,将元器件直接安装在印刷电路板的表面,而不是通过插针或其他连接器连接。
例句
  • 1·Suitable for high density surface mounting .
    适用于高密度表面组装。
  • 2·Available for high density surface mounting.
    适用于高密度表面组装。
  • 3·A new feature allows flush or surface mounting on ceilings and walls.
    一项新性能使其能在天花板和墙壁上齐平安装或表面贴装。
  • 4·Compact and lightweight, High breakdown voltage, Surface mounting type.
    描述: 结构紧凑,重量轻,高击穿电压,表面安装型。
  • 5·Compact and lightweight, High breakdown voltage, Surface mounting type.
    结构紧凑,重量轻,高击穿电压,表面贴装型。
  • 6·Various high power inductors are superior to be high saturation for surface mounting.
    各种高功率电感均优于用于表面安装的高饱和。
  • 7·Component mounting sequence is critical to the efficiency of surface mounting machines.
    元器件贴装顺序是影响贴片机工作效率的关键因素之一。
  • 8·In the surface mounting technology, the result of the solder printing is very big to the product quantity.
    在电子装联技术中,焊膏印刷的效果对产品质量关系极大。
  • 9·It can be used for electroless tin plating on copper substrate in electronic element, surface mounting device and PCB.
    结果表明 :该工艺镀液稳定 ,可用于电子元器件以及表面安装器件、印制电路板等铜基上化学镀锡。
  • 10·The surface mounting sensors have the advantage of being replaced, but they can not solve the issue of monitoring dead load stress.
    表贴传感器具有可更换的优点,但不能解决恒载应力监测问题。