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silicon substrate
硅基底片:一种用于制造电子器件的基础材料
常用释义
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基本释义
  • 硅基底片:一种用于制造电子器件的基础材料,通常是以硅为主要成分的薄片或片状物。
例句
  • 1·The insulating layer is positioned on a first surface of the silicon substrate.
    该绝缘层位于该硅基材的第一表面。
  • 2·The silicon substrate also can be doped with proper carbon, nitrogen or oxygen, etc.
    硅衬底中还可以掺入适量碳、氮或氧等。
  • 3·These Q values are limited by the conductor resistance and eddy current loss in the silicon substrate.
    这些Q值受到导体电阻和硅衬底的涡流损耗的限制。
  • 4·For example, as shown in FIG. 8a, an oxide layer 810 optionally is patterned on a silicon substrate 820.
    例如,如图8a所示,氧化层810选择性地在硅衬底820上形成图案。
  • 5·In addition, the buffer layer can mitigate parallel conduction issues between transistor devices and the silicon substrate.
    此外,缓冲层可以减少晶体管之间的设备和硅衬底平行的传导问题。
  • 6·The electric element is positioned inside the silicon substrate and is exposed on a second surface of the silicon substrate.
    该电性元件位于该硅基材内,且显露于该硅基材的第二表面。
  • 7·It combines an Au microelectrodes array (AuMEA) with two light-addressable potentiometric sensors (LAPS) on a silicon substrate.
    系统由一个电化学微电极阵列和两个光寻址电位传感器组成。
  • 8·A layer of europium oxide red light luminescent thin film is deposited on one side surface of a single crystal silicon substrate.
    在单晶硅衬底的一个侧面沉积有一层氧化铕红光发光薄膜。
  • 9·The method is as follows: the surface of a silicon substrate adopts the three-layer metal wiring of metal 1, metal 2 and metal 3;
    所述 方法是:在硅基板的表面采用金属1、金属2和金属3三层金属布线;
  • 10·Deposition of metallic nickel on silicon substrate by laser-enhanced electroless plating technique is reported for the first time.
    利用激光诱导化学镀技术,首次在硅片上沉积出金属镍。
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