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copper clad laminate
铜包覆层压板:一种用于电子电路板制造的材料
常用释义
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基本释义
  • 铜包覆层压板:一种用于电子电路板制造的材料,由铜箔和绝缘材料层交替堆叠而成。铜箔提供电导性,而绝缘材料层用于隔离电路。
例句
  • 1·Various polyimide was synthesized from 3-BAPP with various dianhydrides. The application of the polyimiders to two-layer flexible copper clad laminate(2L-FCCL)was researched.
    用3-BAPP与多种二酐合成出多种聚酰亚胺,并在二层法挠性覆铜板(2L-FCCL)的应用方面做了一些研究。
  • 2·The invention relates to a halogen-free flame-retardant epoxy resin composite, the flexible copper clad laminate made from the epoxy resin composite and the production method.
    本发明涉及一种无卤阻燃环氧树脂组合物、使用其制作的挠性覆铜板及其 制作方法。
  • 3·In recent years, flexible printed circuit boards based on two layer flexible copper clad laminate has been widely applied in folding mobile phone, digital camera and notebook computer etc.
    近年来,以二层覆铜板为基材的挠性印制电路板,具有薄、轻、结构灵活的鲜明特点,被广泛应用于折叠手机、数码相机、笔记本电脑等。
  • 4·It could accord with the requirement of environment protection completely. And because of the addition of aluminum hydroxide, the production cost of copper clad laminate was reduced greatly.
    该无卤化覆铜板完全符合环保要求,而且由于添加了氢氧化铝,大大降低了生产成本。